Master degree or above in microelectronics, power electronics, electrical engineering, mechanical electronics or other related majors; More than 8 years of experience in electrical development or technology research and development of power semiconductor packaging; Have successful experience in electrical development of SiC modules, and those who develop products to achieve mass production status are preferred; Familiar with the overall situation of semiconductor packaging industry, and have good interpersonal relationships in industry; Possess a solid theoretical foundation for the microstructure, basic working principles, common failure modes and power electronic circuits of power semiconductor devices such as Si, SiC and GaN; Proficient in electromagnetic fields, circuits, power electronics and basic principles of power devices. Master SiC power module electrical design tools (such as Q3D, Pspice, Siwave, etc.); Must have excellent negotiation and problem-solving skills. Self-motivated & learning. Proactive and creative. Excellent time management and ability to work under pressure. Self-confidence. Self-motivated and goal driven. Orientation toward results. Good command of English written and oral communication skills, chinese oral langarage preferred. Track industry technology trends, define electrical design technology roadmaps for SiC power modules; Cooperate with team to complete the pre-research of advanced packaging solutions (Electrical design aspect), and organize electrical technical cooperation with universities and research institutes; Responsible for SiC power module electrical design, simulation and verification of power module packaging, and develop advanced electrical design technique with strong competitiveness in the industry; Responsible for solving difficult problems of power modules, such as oscillation, current sharing, system coupling and module reliability; Responsible for the investigation and dynamic tracking of forward-looking technology of power semiconductor packaging(electrical design aspect); Responsible for the development of sic mosfet chip simulation model, complete the simulation and verification of the dynamic characteristics of the chip model; Responsible for power chip selection, complete chip requirement development, chip screening and optimal patch strategy, and finally complete the batch production introduction and verification of new chips.
Class A OTR and Local Truck Driving Jobs JobDiversified Transfer and Storage, a local LTL carrier, is hiring drivers to join our Billings, MT family. We deliver nationwide and parts of Canada, giving our drivers many options and opportunities to drive the routes they...
...look at the open position below: Sales Development Representative: Research and compile data of Providers' offices, Pharmacies, clinics and other medical facilities to identify eligible-potential clients. Conduct outbound calls to validate potential client...
Class A DEDICATED TEAM DRIVERS-1300 WEEKLY AVG JobRegional Team Dedicated Lanes terminal to terminal, 100% drop and hook pulling doubles. Monday through Friday or Tuesday to Saturday Schedules. Trucks are 2016 & 2017 Volvo Sleeper 670's with tandem axle,I-shift automatic...
...Work Schedule Standard (Mon-Fri) Environmental Conditions Office Job Description As part of the Thermo Fisher Scientific team, youll discover meaningful work that makes a positive impact on a global scale. Join our colleagues in bringing our Mission to...
About Us Cherry Hill Programs brings the magic to every experience by capturing moments that last a lifetime. In partnership with retail locations, tourist attractions and destinations across North America, Cherry Hill Programs contributes millions of holiday and souvenir...